Our manufacturing capabilities enable fast prototyping and short design to product cycle.
We can do the following processes in house:
- Hermetic soldering of RF seals and DC feedthroughs
- Precision assembly of chip components with epoxy
- Epoxy or solder sealing of mechanical covers
- Prototype assembly of the PCBs (screen print, hand assembly, reflow)
- Electro-mechanical assembly (soldering, cabling)
We use qualified local suppliers for the following processes:
- Mechanical production
- Automatic assembly of PCBs
- X-Ray Imaging after Assembly